Built on trust, grown through integrity yw@zh-lx.com 繁體

High-Permeability Low-Frequency EMI Absorbing Sheet for Noise Control Near FPCs and ICs

High-Permeability Low-Frequency EMI Absorbing Sheet for Noise Control Near FPCs and ICs

The C-FO-LF Low-Frequency EMI Absorbing Sheet lets engineers place an EMI countermeasure close to an FPC, processor, or metal shield can while preserving the thin and flexible form needed in compact electronics. Selection starts with the interference frequency, available thickness, and placement area, followed by device-level measurement. A permeability value alone does not establish the noise reduction of an assembled device.

High permeability supports near-field magnetic coupling

The C-FO-LF product page specifies μ′ of 180 ± 20 at 1 MHz. This real permeability component describes magnetic storage and coupling response at the stated frequency, which helps compare candidate materials. Actual suppression also depends on frequency, placement, area, and system geometry.

A thin, flexible sheet fits around FPCs and IC surfaces

The published thickness range is 0.03 to 0.5 mm with ±10% tolerance. Its flexible resin-based composite form can be applied to an FPC or chip surface, placing the material near a noise-coupling region without adding a bulky component to the mechanical stack.

The published band covers several internal EMI scenarios

Lixing lists a recommended frequency band of 10 MHz to 6 GHz and application positions that include FPCs, high-performance processors, mobile-device interiors, and metal shield cans. Engineers should identify the interference peak from a frequency scan before choosing placement, rather than inferring a target frequency from the product name.

Complex permeability separates storage from loss

A technical reference on dielectric and magnetic material measurement expresses complex relative permeability as μr*(ω) = μr′(ω) − jμr″(ω), with magnetic loss tangent tan δm = μr″(ω) / μr′(ω). Here, ω is angular frequency in rad/s, μr′ is the dimensionless real component, μr″ is the dimensionless loss component, and tan δm is dimensionless. This small-signal, approximately linear model explains material behavior. It cannot predict product-level attenuation without the μr″ frequency response, field strength, geometry, and device measurements.

Placement determines whether the material addresses the coupling path

Near an FPC or processor, the sheet can participate in the local field distribution where magnetic coupling is concentrated. Inside a metal shield can, it can support resonance and crosstalk countermeasures. Both uses require before-and-after spectral measurements, so material parameters should not be presented as an assembled-device guarantee.

Provide frequency, space, and bonding conditions for sampling

For specification consultation, provide the interference peak, available placement area, allowable thickness, surface material, and intended verification method. Lixing Composite Materials Co., Ltd. can use those inputs for absorber specification and sample discussions; the website does not provide online checkout.

#EMIAbsorber #HighPermeability #FPC #EMIControl #ElectronicMaterials

EMIEMI absorberFPC

Need a recommendation or samples?

Tell us your process temperature, pressure and size requirements, and our engineers will recommend the right material.