G-TT-GY Fiberglass-Reinforced Thermal Conductive Silicone Tube
Silicone TubingG-TT-GY Fiberglass-Reinforced Thermal Conductive Silicone Tube
The G-TT-GY fiberglass-reinforced thermal conductive silicone tube has a ring-shaped fiberglass cloth reinforcement laye
- Brand
- Lixing Compound Materials
- Origin
- Zhuhai, Guangdong, China
- Supply
- Factory direct; custom sizes and cutting available
- Samples
- Samples available on request
Product Details
The G-TT-GY fiberglass-reinforced thermal conductive silicone tube has a ring-shaped fiberglass cloth reinforcement layer embedded in the center of the tube wall. It offers 1.5 ± 0.3 W/m·K thermal conductivity, electrical insulation, soft compressibility and UL 94 V-0 flame retardancy, for power transistors, MOSFETs, ICs, power modules and all kinds of electronic heat dissipation protection.
Product Overview
The G-TT-GY fiberglass-reinforced thermal conductive silicone tube is made from a silicone rubber base filled with thermally conductive fillers such as aluminum oxide and boron nitride, with a ring of fiberglass cloth embedded in the center of the tube wall as reinforcement. It combines thermal conductivity, electrical insulation, cushioning and structural stability, and maintains low thermal resistance even under low mounting pressure.
In liquid-encapsulation applications, the tube offers high burst pressure and good heat transfer, making it suitable for the insulated heat dissipation of power transistors, MOSFETs, ICs and power modules.
Product Features
- Soft and compressible, conforming to the gap between the component and the heat sink
- Slightly tacky, so no additional adhesive is usually required
- Ring-shaped fiberglass cloth reinforcement in the center of the tube wall improves dimensional stability and pressure resistance
- Combines thermal conductivity, insulation and cushioning
- UL 94 V-0 flame rating
- Operating temperature range: -40 to 200°C
Applications
- Heat transfer and insulation between semiconductors and heat sinks
- Communication equipment
- Computer memory chips and graphics card cooling modules
- Modules with high thermal conductivity requirements and LCD backlight modules
- Power transistors, MOSFETs, ICs and power modules
- Fire-protection equipment
Technical Specifications
| Property | Value | Test standard |
|---|---|---|
| Thermal conductivity | 1.5 ± 0.3 W/m·K | ISO 22007-2 |
| Wall thickness | 5–10 mm | ASTM D374 |
| Density | 3.1 g/cm³ | ASTM D792 |
| Hardness | 30–70 Shore 00 | ASTM D2240 |
| Electrical resistivity | 1012 Ω·cm | ASTM D257 |
| Dielectric breakdown voltage | ≥ 3 kV | ASTM D149 |
| Flammability | V-0 | UL 94 |
| Operating temperature range | -40 to 200°C | — |
| Tensile strength | 2–4 MPa | ASTM D412 |
| Elongation at break | 10–70% | ASTM D412 |
The values above are typical test data; actual specifications can be confirmed according to size and custom requirements.




