特性

导热，耐热压，耐高温，具有良好的热传导性、绝缘、缓冲性，以及极高的恢复力。(各种厚度均可)

产品应用

半导体等电子元件散热用绝缘材料，热压工程用散热保护材料，发热体的散热保护材料。

表面材料

硅胶 + 聚酸亚胺薄膜

导热系数

0.6W/m-k

表面颜色

可客制化

耐温

-40 ° ～200°

硬度

70±5shore A

厚度

0.15mm-0.9mm

一般规格

250mm*50m (宽*长)

硅胶延伸率

40%

体积电阻

1012 Ω

撕裂强度

5kn/m

使用温度

160 ° ～200°

耐电压

6000kv

使用寿命

六个月（以贵司实际压合参数为准，温度与压力越低，使用寿命越长）

产品功能

便于快压热盘离形 
压着时起缓冲作用 
装置于下热盘 
硅胶可以使温度更均匀分布表面，避免作业者烫伤

注意事项

热盘表面必须平整无刮伤，安装时须尽量平贴于热盘表面 
产品不可以大角度对折，以防变形
储存时间 (6个月 保存温度：15-25℃ 保存湿度：≤65%RH )

Properties

Heat conduction, heat resistance, high temperature resistance, good thermal conductivity(various thicknesses are available)

Applications

Insulation materials for heat dissipation of electronic components such as semiconductors, heat-dissipating protective materials for hot-pressing engineering, and heat-dissipating protective materials for heating elements.

Material

Silicone + Kapton

Thermal Conductivity

0.6W/m-k

Color

Customizable

Temperature resistance

-40 ° ～200°

Hardness

70±5shore A

Thickness

0.15mm-0.9mm

Product size

250mm*50m ( Width*Length )

Silicone elongation

40%

Volume resistance

1012 Ω

Tear strength

5kn/m

Operating temperature

160 ° ～200°

Withstand voltage

6000kv

Life long

about 6 month (dependence on the temperature and pressure)

Function

Setup on hot press machine.
Silicone can buffer between device and hot plate when machine pressed on.
Silica gel allows the temperature to be more evenly distributed to the surface, avoiding burns

Notice

The surface of the hot plate must be flat and free of scratches. It should be placed on the surface of the hot plate as much as possible during installation. 
The product can not be folded at a large angle to prevent deformation
Storage time (6 months storage temperature: 15-25 ° C Preservation humidity: ≤ 65% RH)