特性

由硅橡胶和玻璃纤维组成，耐高温耐高压有良好的缓冲性，平整性 ， 高重覆使用率 ， 绝缘 ，导热，容易施工，高耐电压，载体波纤

产品应用

CPU、LED、HEATSINK、LCD-TV、PC。 软性电路板行业。 （可依客户要求定做/裁切）

表面材料

硅胶 + 玻璃纤维

尺寸

长度: 10M(或以片材交货)
厚度: 2.6mm (可客制化) 
宽度: 500mm(可客制化)

比重

1.3g/cm3±0.2 g/cm3

撕裂强度

＞90kgf/c ㎡

延伸率

380%±10%

表面颜色

米色

耐温

耐250度

硬度

60HA±5HA

使用寿命

10000次

使用温度

175度c-250度c

储存寿命

建议保存温度:15-25度c
建议保存湿度: <65%RH 
6个月

Material

Silicone+glass fiber

Size

Length: 10M (Or as a sheet)
Thickness: 1.6mm (can be customized)
Width: 600mm (can be customized)

Proportion

1.3g/cm3±0.2 g/cm3

Life long

Dependent on the environment and the operating terms
Recommended storage temperature: 15-25 degrees 
Recommended storage humidity: <65% RH
6 months

color

WHITE

Thickness of glass fiber

0.2±0.02mm

Hardness

60HA±5HA

Elongation rate

＞380%±10%

Peel strength

＞80kgf/c ㎡

Operating temperature

160° ~250°

Storage time

6 month

Function

Setup on hot press machine.
Silicone can buffer between device and hot plate when machine pressed on.
Silica gel allows the temperature to be more evenly distributed to the surface, avoiding burns

Notice

The surface of the hot plate must be flat and free of scratches. It should be placed on the surface of the hot plate as much as possible during installation. 
The product should not be folded at a large angle to prevent deformation.
The recommended temperature is 160-250°.